Qualcomm has just introduced their new flagship processor, the Snapdragon 845 which proves to be a decent upgrade from its predecessor, the Snapdragon 835. Recently, there was a leak that surfaced on Weibo which gives us details on the new mid and low tier processors from the company.
First, is the Snapdragon 670 which will succeed the 660 and will be using 10 nm manufacturing process. It will feature octa-core design with four Kryo 360 cores at 2GHz and four Kryo 385 cores at 1.6GHz with an Adreno 620 GPU. Devices equipped with this processor will support 26MP sensors or 13MP + 13MP setup. It will support LTE Cat 16 with speeds up to 1Gbps for download and 150Mbps for uploads.
Next in the mid-tier range is the Snapdragon 640 which comes with a unique 6+2 core setup. There will be six Kryo 360 cores clocked at 1.55GHz and two Kryo 360 cores clocked at 2.15GHz which is possible thanks to ARM’s DynamIQ which allows mix and match of Cortex-A75 and A55 CPU cores. As for transfer speeds, it will support 600Mbps download and 150Mbps upload.
Finally, is the Snapdragon 460 which comes with eight cores, four Kryo 360 cores clocked at 1.8GHz and four Kryo 360 cores clocked at 1.4GHz. Phones equipped with this processor will support a single camera up to 21MP resolution and it shares the same download and upload speeds as the Snapdragon 640.
We should be seeing phones that come with these new mid and low range processors in 2018, offering a broader range of budget and entry-level phones.
