LG’s next high-end project scheduled for March 2016 which will be replacing the current successor to curved LG G Flex 2 which been introduced during CES 2015. The new LG G Flex 3 will be powered by Qualcomm Snapdragon 820 with a 4GB of RAM and a metal construction (we expect it will have a solid build compare to Flex 2).
When the processor Snapdragon 820 been mentions it will be on the device, there are a lot of people will be assuming the device will be hot. But, there’s only one reviewer has confirmed that no heating issues identified with the Qualcomm’s SD 820. There will be 32GB of expandable storage built-in and a 6-inch display with QHD resolution, which will show the crispy screen to its max performance. In the camera department, the Flex 3 will be having a 20.7 MP rear camera and an 8 MP front-facing camera.
Apparently, the company might include a fingerprint sensor directly at the back of the phone together with the volume rocker buttons. However, there isn’t any confirmation from the leak and there might be changes in the near future because we are about seven months away before the official statement from LG.
Apparently, the company might include a fingerprint sensor directly at the back of the phone together with the volume rocker buttons. However, there isn’t any confirmation from the leak and there might be changes in the near future because we are about seven months away before the official statement from LG.
The LG G Flex 3 might be priced at USD 1000 (approx. RM 3,800), which the price tag seems a bit too expensive. However, there might be certain changes that will occur in the near future and stay tuned for more updates on it.
