After officially launching the thinnest foldable phone in Malaysia, Honor is set to make the next breakthrough with the global announcement of the Honor Magic 6 series at Mobile World Congress 2024, which is set to happen on 25 February 2024, 9PM Malaysia time.
The Honor Magic 6 series is the company’s answer to Samsung’s Galaxy S24 series, comprising the Magic 6 and Magic 6 Pro, these phones have already launched back in China and boasts a premium design and upgraded cameras from their respective predecessors.
Powered by the Snapdragon 8 Gen 3 chipset, the Honor Magic 6 series is expected to take on the competition when it comes to photography, particularly the Honor Magic 6 Pro, which features a main 50MP camera with a variable aperture range of f/1.4-f/2.0, and an optically stabilized 180MP telephoto camera that does up to 2.5x optical zoom.
The Magic 6 Pro also features a large 5600mAh battery that supports 80W fast wired charging and 66W fast wireless charging, while the regular Magic 6 features a 5450mAh battery that supports 66W fast wired charging and 60W fast wireless charging.
These are great improvements over the Magic 5 series and knowing Honor, we could also see it priced more competitively when it launches the phones in Malaysia, so definitely stay tuned for more announcements coming up.