A report published by Bloomberg has confirmed that TSMC has started production of Apple’s new A13 chipset for 2019 iPhones. The A13 reportedly went into early test production in April and is planned to be mass produced before the end of this month.
The Apple A13 mobile chipset will be built using TSMC’s second-generation 7nm node utilizing extreme ultraviolet (EUV) lithography. We can expect the Apple A13 chipset to be a significant upgrade over the A12 in terms of performance.
The Bloomberg report also confirms the 2019 iPhones will come with more cameras than Apple’s 2018 lineup. While the iPhone XR successor will have a dual-camera setup on the back with an improved zoom range, the high-end models will have a triple-camera setup on the back. The additional camera on the back of the iPhone XS and XS Max successors will have an ultra-wide-angle lens.
In terms of software features, Apple is said to be working on an auto-correction feature that will fit people back into a photo who may have been accidentally cut out. As shown by leaked renders of the 2019 iPhone models, the rear camera array will fit into a square on the top left corner. All the 2019 iPhones will come with reverse wireless charging support as well, similar to the latest flagship smartphones from Huawei and Samsung.