Next year’s Snapdragon 875 chipset is said to be pack a few performance upgrades, while focusing on power-efficiency and an increased cache and memory bandwidth.
Occupying the 5nm wafer is supposedly 1x 2.84GHz Cortex-X1 core, 3x Cortex A-78 @ 2.42GHz modules, and 4x Cortex-A55 @ 1.8GHz cores. According to reports, the Cortex-X1 module will bring 20% better sustained performance than the A78, and 30% better peak performance.
For graphics, the chip will pack the Adreno 660 GPU; on top of that, we can expect it to also ship with the Snapdragon X60 modem which will bring both mmWave and sub-6 GHz connectivity to the phone.
In any case, we’ll learn more about the Snapdragon 875 sometime next month, so we’ll know soon exactly what it packs.