Image credit: Samsung

Samsung have begun the mass production of its uMCP, UFS-based multichip package that will pack 12GB of LPDDR4X RAM as well as UFS 3.0 storage.

According to Samsung’s blog post, they are built on their own 24-gigabit chips and each will combine four of that as well as an ultra-fast eUFS 3.0 NAND storage unit into one package. The chipset is set to be used in Samsung’s upper mid-range devices, which is great news considering we mostly only see 12GB RAM on high-end smartphones.

Samsung says that their new tech will aid running data-intensive tasks on increasingly higher-resolution display smartphones – outputting 1.5 times more capacity compared to the previous 8GB package. The new 12GB chipset will be able to support 4K video recording as well as AI and machine learning for these mid-range smartphones.

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Considering how good Samsung’s mid-rangers are this year, we’re undoubtedly excited to see what the Korean giants can muster next year with the addition of their new memory chip offering.


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